Production Overview

Plastic  Thin Small Outline packaging (TSOP) is a principal package using SMD technology. It is widely used in low cost and manual applications. NFME offers TSOP with 48 lead counts. The package body is 12* 20mm

 

Application

Thin Small Outline packages are considered one of the most established industry standard packages. TSOP is commonly used memory modules, portable electronic products,  cell phones, etc.

 

Features

* JEDEC standard compliant or reference
* Wide choice of pad sizes to meet die size per customer lead frame design capability
* Pb-free process ready and Green Molding Compound

 

Design Rule

Minimum Ink Size: 20mil (500 um) diameter or non-ink with wafer mapping

 

Maximum Ink Height: 1mil(25um)

 

Minimum Sawing street width: 2.4mil (80um)

 

Wafer Thickness: Back grinding is required if the thickness exceeds NFME spec.

 

 

 

Pkg type

Pkg size

Wafer thickness

TSOP

All

10~12 mil (250~300 um)

 

Wire Bond Rule

 

Wire size

Min. bond pad pitch

Min. bond pad opening

Wire loop control

 

50um (2.0mil)

200 um

150 um

Max. wire length
loop height

5000um
<200um

38um (1.5mil)

170 um

100um

Max. wire length
loop height

5000um
<200um

33 um (1.3mil)

150 um

90 um

Max. wire length
loop height

5000um
<200um

30 um (1.2mil)

150um

90 um

Max. wire length
loop height

5000um
<200um

25um (1.0mil)

70um

60um

Max. wire length
loop height

5000um
<200um

23um (0.9mil)

60 um

50um

Max. wire length
loop height

3000um
<200um

20 um (0.8mil)

60 um

50 um

Max. wire length
loop height

3000um
<200um

 

 

Package Outline

 

TSOP 48(All units are in mm)

PKG TYPE

Lead count

Lead Pitch

Lead Width

Lead Thickness

BD

POD

TSOP

48

0.50

0.20

0.15

DOWN

DOWN

 

Packing & Shipping

 

TSOP 48 (Tray)

PKG TYPE

Lead count

QTY/Tray

Tray/Inner Box

TSOP

48

96

10+1(Bank)

 

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